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INTEGRATED CIRCUITS
DATA SHEET
TDA1565TH High efficiency 2 x 40 W / 2 stereo car radio power amplifier
Product specification Supersedes data of 2003 Aug 13 2004 Jan 27
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
FEATURES * Low dissipation due to switching from Single-Ended (SE) to Bridge-Tied Load (BTL) mode * Differential inputs with high Common Mode Rejection Ratio (CMRR) * Mute, standby or operating mode selectable by pin * Load dump protection circuit * Short-circuit safe to ground; to supply voltage and across load * Loudspeaker protection circuit * Thermal protection at high junction temperature * Device switches to single-ended operation at high junction temperature * Clip detection at 2.5 % THD * Diagnostic signal indicating clipping, short-circuit protection and pre-warning of thermal protection. QUICK REFERENCE DATA SYMBOL VP PARAMETER supply voltage CONDITIONS DC-biased non-operating load dump IORM Iq(tot) Istb Zi Po repetitive peak output current total quiescent current standby current differential input impedance output power RL = 2 ; THD 0.5 % RL = 2 ; THD 10 % RL = 2 ; EIAJ Gv CMRR SVRR VO cs Gv voltage gain common mode rejection ratio supply voltage ripple rejection DC output offset voltage channel separation channel unbalance Rs = 0 ; Po = 25 W f = 1 kHz; Rs = 0 f = 1 kHz; Rs = 0 RL = MIN. 6.0 - - - - - 90 25 37 - 25 - 50 - 50 - GENERAL DESCRIPTION
TDA1565TH
The TDA1565TH is a monolithic power amplifier in a 20-lead heatsink small outline plastic package. It contains two identical 40 W amplifiers. Power dissipation is minimized by switching from SE to BTL mode only when a higher output voltage swing is needed. The device is developed primarily for car radio applications.
TYP. 14.4 - - - 95 1 120 31 40 60 26 80 65 - 70 -
MAX. 18 30 45 8 150 50 150 - - - 27 - - 100 - 1
UNIT V V V A mA A k W W W dB dB dB mV dB dB
ORDERING INFORMATION TYPE NUMBER TDA1565TH PACKAGE NAME HSOP20 DESCRIPTION plastic, heatsink small outline package; 20 leads; low stand-off height VERSION SOT418-3
2004 Jan 27
2
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
BLOCK DIAGRAM
TDA1565TH
handbook, full pagewidth
VP1 20
VP2 11
TDA1565TH
+
SLAVE CONTROL 7
- -
OUT2 -
channel 2 IN2 - IN2 + 13
MUTE
-
V/I
I/V
8
OUT2 +
+ -
V/I
14
+
60 k 60 k 25 k Vref
+
VP 16
CIN
19
- +
CSE
60 k IN1- IN1+ 18
60 k V/I
+ +
V/I
- +
I/V 3 OUT1-
17 MUTE channel 1
- - -
4
n.c. n.c. n.c. n.c.
1 9 10 12 STANDBY LOGIC 2
SLAVE CONTROL
OUT1+
+
CLIP DETECTION AND THERMAL PROTECTION PRE-WARNING 15 6 5
MHC600
MODE
DIAG
GND2
GND1
Fig.1 Block diagram.
2004 Jan 27
3
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
PINNING SYMBOL n.c. MODE OUT1- OUT1+ GND1 GND2 OUT2- OUT2+ n.c. n.c. VP2 n.c. IN2- IN2+ DIAG CSE IN1+ IN1- CIN VP1 PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION not connected mute/standby/operating mode selection inverting channel 1 output non-inverting channel 1 output ground 1 ground 2 inverting channel 2 output non-inverting channel 2 output not connected not connected supply voltage 2 not connected inverting channel 2 input non-inverting channel 2 input diagnostic output electrolytic capacitor for SE mode non-inverting channel 1 input inverting channel 1 input common input supply voltage 1
VP1 20 CIN 19 IN1- 18 IN1+ 17 CSE 16 DIAG 15 IN2+ 14 IN2- 13 n.c. 12 VP2 11
001aaa306
TDA1565TH
1 2 3 4
n.c. MODE OUT1- OUT1+ GND1 GND2 OUT2- OUT2+ n.c.
TDA1565TH
5 6 7 8 9
10 n.c.
Fig.2 Pin configuration.
2004 Jan 27
4
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
FUNCTIONAL DESCRIPTION The TDA1565TH contains two identical amplifiers with differential inputs. At low output power (output amplitudes of up to 3 V (RMS) at VP = 14.4 V), the device operates as a normal SE amplifier. When a larger output voltage swing is required, the circuit automatically switches internally to BTL operation. With a sine wave input signal, the power dissipation of a conventional BTL amplifier with an output power of up to 3 W is more than twice the power dissipation of the TDA1565TH (see Fig.10). During normal use, when the amplifier is driven by typical variable signals such as music, the high (BTL) output power is only needed for a small percentage of time. Assuming that a music signal has a normal (Gaussian) amplitude distribution, the power dissipation of a conventional BTL amplifier with the same output power is approximately 70 % higher (see Fig.11). The heatsink must be designed for music signal operation. When such a heatsink is used, the IC's thermal protection will disable the BTL mode when the junction temperature exceeds 150 C. In this case the output power is limited to 10 W per amplifier. The gain of each amplifier is internally fixed at 26 dB. The device can be switched to any of the following modes by applying the appropriate voltage to the MODE pin (see Fig.3): * Standby with low standby current (less than 50 A) * Mute condition; DC adjusted * On, operation. The device is fully protected against a short-circuit of the output pins to ground or to the supply voltage. It is also protected against a loudspeaker short-circuit and against high junction temperatures. In the event of a permanent short-circuit condition, the output stage is repeatedly switched on and off with a low duty-cycle resulting in low power dissipation. When the supply voltage drops below 6 V (e.g. vehicle engine start), the circuit is immediately muted to prevent audible `clicks' that may be produced in the electronic circuitry preceding the power amplifier. The voltage across the SE electrolytic capacitor connected to pin 16 is kept at 0.5 VP by a voltage buffer (see Fig.1). The capacitor value has an important influence on the output power in SE mode, especially at low frequency signals; a high value is recommended to minimize power dissipation at low frequencies.
4 3 Mute 2 1 Standby 0
TDA1565TH
MODE handbook, halfpage (V)
V
18
Operating
MGR176
Fig.3
Switching levels of the mode select pin (pin MODE).
The diagnostic output indicates the following conditions: * Clip detection at 2.5 % THD (see Fig.4) * Short-circuit protection (see Fig.5): - When an output short-circuit occurs (for at least 10 s); the output stages are switched off for approx. 500 ms, after which time the outputs are checked to see if a short-circuit condition still exists. During any short-circuit condition, the power dissipation is very low. During a short-circuit condition pin DIAG is at logic LOW. * Start-up/shutdown; when the product is internally muted * Thermal protection pre-warning: - If the junction temperature rises above 145 C but is below the thermal protection temperature of 150 C, the diagnostic output indicates that the thermal protection condition is about to become active. This pre-warning can be used by another device to reduce the amplitude of the input signal which would reduce the power dissipation. The thermal protection pre-warning is indicated by a logic LOW at pin DIAG.
2004 Jan 27
5
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
Heatsink design
TDA1565TH
handbook, halfpage V
OUT1;
MHC601
There are two parameters that determine the size of the heatsink. The first is the rating of the virtual junction temperature and the second is the ambient temperature at which the amplifier must still deliver its full power in the BTL mode. Example:
VOUT2 0
VDIAG
With a conventional BTL amplifier, the maximum power dissipation for a typical signal, such as music (at each amplifier) will be approximately two times 15 W. At a virtual junction temperature of 150 C and a maximum ambient temperature of 65 C, Rth(vj-c) = 1.8 K/W and Rth(c-h) = 0.2 K/W. For a conventional BTL amplifier the thermal resistance of the heatsink should be: 150 - 65 --------------------- - 1.8 - 0.2 = 0.83 K/W 2 x 15 Compared to a conventional BTL amplifier, the TDA1565TH has a higher efficiency. The thermal resistance of the heatsink should be: 150 - 65 --------------------- - 1.8 - 0.2 = 2.25 K/W (see Fig.6). 2 x 10 Fig.4 Clip detection waveforms.
0 t
handbook, halfpage
loudspeaker short-circuit IOUT1; IOUT2 Imax
short-circuit removed output pins short-circuit (to ground)
handbook, halfpage
virtual junction channel 1 channel 2 3.0 K/W
t
3.0 K/W Imax 0.3 K/W VDIAG case
MHC586
0
500 ms 500 ms 500 ms 500 ms 500 ms
t
10 s 10 s
10 s
10 s 10 s
MHC595
Fig.5 Short-circuit protection waveforms.
Fig.6 Equivalent thermal resistance network.
2004 Jan 27
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Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VP supply voltage PARAMETER CONDITIONS operating non operating load dump; tr > 2.5 ms VP(sc) Vrp IORM Ptot Tstg Tvj Tamb short-circuit safe voltage reverse polarity voltage repetitive peak output current total power dissipation storage temperature virtual junction temperature operating ambient temperature - - - - - - - -55 - -40
TDA1565TH
MIN.
MAX. 18 30 45 16 6 8 60 +150 150 +85
UNIT V V V V V A W C C C
THERMAL CHARACTERISTICS SYMBOL Rth(j-c) Rth(j-a) PARAMETER thermal resistance from junction to case thermal resistance from junction to ambient CONDITIONS see Fig.6 in free air VALUE 1.8 40 UNIT K/W K/W
2004 Jan 27
7
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 C; measured in Fig.7; unless otherwise specified. SYMBOL Supplies VP Iq(tot) Istb VCSE VO supply voltage quiescent current standby current average voltage of SE electrolytic capacitor at pin 16 DC output offset voltage on state mute state Mode select switch (see Fig.3) VMODE voltage at mode select pin standby condition mute condition on condition IMODE Diagnostic VDIAG IDIAG Protection Tpre Tdis(BTL) Notes 1. The circuit is DC-biased at VP = 6 to 18 V and AC-operating at VP = 8 to 18 V. 2. If the junction temperature exceeds 150 C, the output power is limited to 10 W per channel. pre-warning temperature BTL disable temperature note 2 - - 145 150 voltage at diagnostic output pin protection/temp pre-warning/clip detection diagnostic sink current VDIAG < 0.5 V - 2 - - mode select input current VMODE = 5 V 0 2 4 - - - 5 25 note 1 RL = 6.0 - - - - - 14.4 95 1 7.1 - - PARAMETER CONDITIONS MIN. TYP.
TDA1565TH
MAX.
UNIT
18.0 150 50 - 100 100
V mA A V mV mV
1 3 VP 40
V V V A V mA C C
0.5 - - -
2004 Jan 27
8
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
AC CHARACTERISTICS VP = 14.4 V; RL = 2 ; f = 1 kHz; Tamb = 25 C; measured in Fig.7; unless otherwise specified. SYMBOL Po PARAMETER output power CONDITIONS RL = 2 ; THD = 0.5 % RL = 2 ; THD = 10 % RL = 2 ; EIAJ VP = 13.2 V; THD = 0.5 % VP = 13.2 V; THD = 10 % THD P Bp fro(l) fro(h) Gv SVRR total harmonic distortion power dissipation power bandwidth low frequency roll-off high frequency roll-off closed-loop voltage gain supply voltage ripple rejection THD = 0.5 %; Po = -1 dB with respect to 25 W -1 dB; note 2 -1 dB Po = 1 W; (see Fig.16) Rs = 0 ; Vripple = 2 V(p-p); (see Fig.17) on/mute standby CMRR Zi Zi VSE-BTL Vout Vn(o) common mode rejection ratio differential input impedance mismatch in input impedance SE to BTL switch voltage level output voltage mute (RMS value) noise output voltage note 3 Vi = 1 V (RMS) on; Rs = 0 ; note 4 on; Rs = 10 k; note 4 mute; note 5 cs Gv Notes 1. The distortion is measured with a bandwidth of 10 Hz to 30 kHz (see Figures 20 and 21). 2. Frequency response externally fixed (input capacitors determine the low frequency roll-off). 3. The SE to BTL switch voltage level depends on the value of VP. 4. Noise output voltage measured with a bandwidth of 20 Hz to 20 kHz. 5. Noise output voltage is independent of the source resistance (Rs). channel separation channel unbalance Rs = 0 ; Po = 25 W f = 1 kHz; Rs = 0 - 90 - - - - - - 50 - 50 65 90 80 120 1 3 95 95 100 90 70 - Po = 1 W; note 1 MIN. 25 37 - - - - - - 130 25
TDA1565TH
TYP. 31 40 60 26 34 0.1 20 to 15000 25 - 26
MAX. - - - - - - - - - 27
UNIT W W W W W % W Hz Hz kHz dB
see Figs 10 and 11
- - - 150 - - 150 150 - 150 - 1
dB dB dB k % V V V V V dB dB
2004 Jan 27
9
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
TEST AND APPLICATION INFORMATION
TDA1565TH
handbook, full pagewidth
VP1 20
VP2 11
220 nF
2200 F
VP
TDA1565TH -
0.5Rs 220 nF 2 IN2- 13 7 OUT2- 100 nF 3.9 100 nF
+
3.9
-
0.5Rs 220 nF IN2+ 14 60 k CIN 19 10 F 60 k IN1- 18 60 k 60 k 25 k Vref
8 OUT2+
+
16 CSE 2200 F
0.5Rs 220 nF
+ -
3 OUT1- 3.9 100 nF 4 OUT1+ 100 nF 3.9
2 0.5Rs 220 nF IN1+ 17
+ -
STANDBY LOGIC 2 VMODE MODE
CLIP AND DIAGNOSTIC 15 DIAG Rpu 10 k Vlogic
MHC603
signal ground 6 5 power ground
GND2 GND1
Connect Boucherot (IEC-60268) filter to pin 4 and pin 7 using the shortest possible connection. Rs = Source resistance.
Fig.7 Application diagram.
2004 Jan 27
10
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
TDA1565TH
handbook, full pagewidth
DIAG IN2
AGND 220 nF IN1 1000 F 22 F 10 F
on
2200 F
22 F
TDA1564TH/65TH
off
VP
GND
Out1
Out2
MHC587
a. Top silk screen (top view).
b. Top copper track (top view).
Fig.8 PCB layout (component side) for the application shown in Fig.7.
2004 Jan 27
11
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
TDA1565TH
handbook, full pagewidth
2.7 k 220 nF 220 nF
51 k
3E9 220 nF 100 nF
3E9 100 nF
150 k 100 nF 3E9 3E9 100 nF
MHC588
a. Bottom silk screen (top view; legend reversed).
b. Bottom copper track (top view).
Fig.9 PCB layout (soldering side) for the application shown in Fig.7.
2004 Jan 27
12
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
TDA1565TH
handbook, halfpage
50
MHC589
handbook, halfpage
(1)
40
MHC590
P (W) 40
P (W) 30
(1)
(2)
30 20 20 10 10
(2)
0 0 10 20 Po (W) 30
0 0 2 4 6 8 Po (W) 10
Input signal 1 kHz, sinusoidal; VP = 14.4 V; RL = 2 . (1) For a conventional BTL amplifier. (2) For TDA1565TH.
Input signal IEC 268 filtered pink noise; VP = 14.4 V; RL = 2 . (1) For a conventional BTL amplifier. (2) For TDA1565TH.
Fig.10 Power dissipation as a function of output power; sine wave driven.
Fig.11 Power dissipation as a function of output power; pink noise through IEC-60268 filter.
430
2.2 F
330
2.2 F
470 nF
input
3.3 k
91 nF
3.3 k
68 nF
10 k
output
MGC428
Fig.12 IEC-60268 filter.
2004 Jan 27
13
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
TDA1565TH
handbook, full pagewidth
VP1 20
VP2 11
220 nF
2200 F
VP
TDA1565TH -
IN2- 13 220 nF 2 7 OUT2- 100 nF 3.9 100 nF
+
3.9
-
IN2+ 14 220 nF 60 k 60 k 25 k Vref
8 OUT2+
+
CIN 19 10 F IEC-60268 FILTER IN1- 18 pink noise 220 nF 60 k
16 CSE 2200 F
60 k
+ -
3 OUT1- 3.9 100 nF 4 OUT1+ 100 nF 3.9
2 IN1+ 17 220 nF
+ -
INTERFACE signal ground MODE 2 MODE VMODE DIAG 15 6 5 power ground
DIAG GND2 GND1 Rpu Vlogic
MHC604
Fig.13 Test and application diagram for dissipation measurements with a simulated music signal (pink noise).
2004 Jan 27
14
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
TDA1565TH
handbook, halfpage
150
MHC598
handbook, halfpage
200
MHC599
IP (mA)
IP (mA) 150
(3)
100
100
(2)
50 50
0 0 8 16 VP (V) 24
0 0
(1)
1
2
3
4 5 VMODE (V)
VMODE = 5 V; RL = .
VIN = 5 mV; VP = 14.4 V. (1) Standby. (2) Mute. (3) Operating.
Fig.14 Quiescent current as a function of VP.
Fig.15 IP as a function of VMODE.
handbook, halfpage
28
MHC597
handbook, halfpage
0
MHC591
Gv (dB) 26
SVRR (dB) -20
24
-40
22
-60
20
10
102
103
104
105 f (Hz)
106
-80 10
102
103
104 f (Hz)
105
VIN = 100 mV.
(Vripple = 2 V (p-p).
Fig.16 Gain as a function of frequency.
Fig.17 SVRR as a function of frequency.
2004 Jan 27
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Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
TDA1565TH
handbook, halfpage
-10
MHC592
cs (dB)
handbook, halfpage Po
(W)
0.8
MHC596
-30
0.6
(1)
-50
(2)
0.4
(1)
(2)
-70
0.2
-90 10
102
103
104 f (Hz)
105
0 0 8 16
VP (V)
24
(1) Po = 1 W. (2) Po = 10 W.
VIN = 50 mV. (1) Low supply mute. (2) Load dump.
Fig.18 Channel separation as a function of frequency.
Fig.19 AC operation as a function of VP.
2004 Jan 27
16
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
TDA1565TH
102 handbook, full pagewidth THD + noise (%) 10
MHC594
1
(1) (2)
10-1
(3)
10-2 0.1
0.2
0.5
1
2
5
10
20
50 Po (W)
RL = 2 . (1) 10 kHz. (2) 1 kHz. (3) 100 Hz.
Fig.20 THD + noise as a function of Po.
2004 Jan 27
17
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
TDA1565TH
MHC593
handbook, full pagewidth
10
THD + noise (%)
(1)
1
10-1
(2)
10-2 10
102
103
104
f (Hz)
105
RL = 2 . (1) Po = 10 W. (2) Po = 1 W.
Fig.21 THD + noise as a function of frequency.
2004 Jan 27
18
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
TDA1565TH
handbook, full pagewidth
VP Vload
MBH691
0
-VP VP Vmaster 1/2 VP
0 VP Vslave 1/2 VP
0
0
1
2
t (ms)
3
Also see Fig.7. Vload = (VOUT2+)-(VOUT2-) or (VOUT1+)-(VOUT1-). Vmaster = VOUT2+ or VOUT1-. Vslave = VOUT2- or VOUT1+.
Fig.22 Output waveforms.
2004 Jan 27
19
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
Application notes ADVANTAGES OF HIGH EFFICIENCY 1. Power conversion improvement (power supply): The fact that the reduction of power dissipation is directly related to a reduction of supply current is often neglected. One advantage is voltage is dropped over the whole supply chain. Another advantage is reduced stress for the coil in the supply line. Even the adapter or supply circuit is cooler due to the reduced dissipation of heat in the whole chain because more supply current will be converted into output power. 2. Power dissipation reduction: This is the best known advantage of high efficiency amplifiers. 3. Heatsink size reduction. The size of heatsink for a conventional amplifier can be reduced by approximately 50 % at VP = 14.4 V when the TDA1565TH is used. In this case, the maximum heatsink temperature remains the same. 4. Heatsink temperature reduction: The power dissipation and the thermal resistance of the heatsink determine the rise in heatsink temperature. If the same sized heatsink of a conventional amplifier is used, the maximum heatsink temperature and the maximum junction temperature both decrease, which extends the life of the semiconductor device; the maximum power dissipation for music, or similar input signals decreases by 40 %. It is clear that the use of the TDA1565TH saves a significant amount of energy. The maximum supply current decreases by approximately 32 %, which reduces the power dissipation in the amplifier as well as in the whole supply chain. The TDA1565TH allows the size of the heatsink to be reduced by approximately 50 %, or the temperature of the heatsink to be reduced by 40 % if the size of the heatsink is unchanged.
handbook, halfpage
TDA1565TH
VP = 14.4 V
Supply current reduction of 32%
Power dissipation reduction of 40% at Po = 3.2 W
Same junction temperature
choice
Same heatsink size
Heatsink size reduction of 50%
Heatsink temperature reduction of 40%
MHC610
Fig.23 Heatsink design.
ADVANTAGE OF THE CONCEPT USED BY TDA1565TH Because the TDA1565TH uses a single-ended capacitor to create a non-dissipating half supply voltage, it is highly efficient under all conditions. Other design concepts rely on the fact that both input signals have the same amplitude and phase. Using a SE capacitor prevents any adverse affects on efficiency that could result from any form of processing that may have been applied to the input signals, such as amplitude difference, phase shift or delays between both input signals, or other DSP processing.
2004 Jan 27
20
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
INTERNAL PIN CONFIGURATIONS PIN 2 NAME MODE
2
TDA1565TH
EQUIVALENT CIRCUIT
MHC607
3, 8
OUT1+, OUT2-
VP1, VP2
3, 8
16
MHC608
4, 7
OUT1+, OUT2-
VP1, VP2
4, 7
16
MHC609
15
DIAG
VP2
15
MGW264
2004 Jan 27
21
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
PIN 16 CSE NAME EQUIVALENT CIRCUIT
VP2
TDA1565TH
16
MHC606
17, 18, 13, 14, 19
IN1+, IN1- IN2+, IN2- CIN
13, 14, 17, 18
VP1, VP2
VP1, VP2
19
MHC605
2004 Jan 27
22
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
PACKAGE OUTLINE
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
TDA1565TH
SOT418-3
D
E x
A X
c y E2 HE vM A
D1 D2 1 pin 1 index Q A2 E1 A4 Lp detail X 20 Z e bp 11 wM (A3) A 10
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) bp c D(2) D1 D2 1.1 0.9 E(2) 11.1 10.9 E1 6.2 5.8 E2 2.9 2.5 e 1.27 HE 14.5 13.9 Lp 1.1 0.8 Q 1.7 1.5 v w x y Z 2.5 2.0 8 0
+0.08 0.53 0.32 16.0 13.0 -0.04 0.40 0.23 15.8 12.6
0.25 0.25 0.03 0.07
Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT418-3 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 02-02-12 03-07-23
2004 Jan 27
23
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept: * below 225 C (SnPb process) or below 245 C (Pb-free process) - for all BGA, HTSSON-T and SSOP-T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages. * below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. 2004 Jan 27 24
TDA1565TH
If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE(1) BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA, USON, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC(5), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L(8), PMFP(9), WQCCN..L(8) Notes not suitable not suitable(4) suitable not not recommended(5)(6) recommended(7)
TDA1565TH
SOLDERING METHOD WAVE REFLOW(2) suitable suitable suitable suitable suitable not suitable
not suitable
1. For more detailed information on the BGA packages refer to the "(LF)BGA Application Note" (AN01026); order a copy from your Philips Semiconductors sales office. 2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. 4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 5. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. 9. Hot bar or manual soldering is suitable for PMFP packages.
2004 Jan 27
25
Philips Semiconductors
Product specification
High efficiency 2 x 40 W / 2 stereo car radio power amplifier
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
TDA1565TH
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2004 Jan 27
26
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2004
SCA76
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R32/02/pp27
Date of release: 2004
Jan 27
Document order number:
9397 750 12581

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